L-3 Communications Infrared Products2007-04-14 12:07:28
L-3 Communications Infrared and Black Forest Engineering Unveil World's First 1024 X 768 Uncooled IR Focal Plane Array.
1024 x 768 FPA offers more than a 250 percent increase in pixels over any other uncooled FPA available
L-3 Communications Infrared Products will showcase images from the first uncooled focal plane array (FPA) with 1024 x 768 pixel resolution at SPIE Defense and Security in Orlando, Fla., from April 10 - April 12, at booth #807. This quantum leap forward in thermal imaging performance will bring substantial benefits to users: significantly longer viewing range, appreciably greater scene detail and considerably more capable electronic zoom. The FPA will also take another leap - downward - as its price will be a fraction of the cost of comparable high-res cooled thermal imaging products.
"True to our commitment to setting performance standards, this step forward will change the landscape of uncooled thermal imaging,� Richard Darlow, president, L-3 Communications Infrared Products, said. "This is another in a long line of industry firsts that reaffirms our legacy as a true pioneer and innovator and it will greatly enhance the value proposition of uncooled thermal imaging.�
The 1024 x 768 BFE262 FPA was developed by prime contractor Black Forest Engineering (BFE) on a Phase II SBIR for NASA Langley under contract number NNL05AA11C.
"We could not have even considered this ambitious development without the tremendous expertise that L-3 Communications Infrared provided with their advanced high-performance a-Si detector technology used to fabricate the required 20um pitch detectors, and packaging of the largest known wafer level vacuum packaged IC,� BFE president, Stephen Gaalema said.
This demonstration marks the next step in the development of higher-performing amorphous silicon technology that will be included in L-3 Communications Infrared's new portfolio of 17 micron technology. Production is expected to begin in the next 12 to 18 months.
1024 x 768 FPA offers more than a 250 percent increase in pixels over any other uncooled FPA available
L-3 Communications Infrared Products will showcase images from the first uncooled focal plane array (FPA) with 1024 x 768 pixel resolution at SPIE Defense and Security in Orlando, Fla., from April 10 - April 12, at booth #807. This quantum leap forward in thermal imaging performance will bring substantial benefits to users: significantly longer viewing range, appreciably greater scene detail and considerably more capable electronic zoom. The FPA will also take another leap - downward - as its price will be a fraction of the cost of comparable high-res cooled thermal imaging products.
"True to our commitment to setting performance standards, this step forward will change the landscape of uncooled thermal imaging,� Richard Darlow, president, L-3 Communications Infrared Products, said. "This is another in a long line of industry firsts that reaffirms our legacy as a true pioneer and innovator and it will greatly enhance the value proposition of uncooled thermal imaging.�
The 1024 x 768 BFE262 FPA was developed by prime contractor Black Forest Engineering (BFE) on a Phase II SBIR for NASA Langley under contract number NNL05AA11C.
"We could not have even considered this ambitious development without the tremendous expertise that L-3 Communications Infrared provided with their advanced high-performance a-Si detector technology used to fabricate the required 20um pitch detectors, and packaging of the largest known wafer level vacuum packaged IC,� BFE president, Stephen Gaalema said.
This demonstration marks the next step in the development of higher-performing amorphous silicon technology that will be included in L-3 Communications Infrared's new portfolio of 17 micron technology. Production is expected to begin in the next 12 to 18 months.
For more information contact:
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